多層配線板及び多層配線板製造方法

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board that can be manufactured by simple, low-cost technique without complexity of manufacture nor waste of materials and can have an IC chip included in a substrate and also mounted on both the surfaces. <P>SOLUTION: The multilayer wiring board includes the IC chip 20, a one-side wiring circuit board 1 which has a first wiring circuit 11 disposed on one surface of a first insulating base material 10 and an adhesive layer 12 on the other side, and also has a conductive paste via 15 electrically connected to the first wiring circuit 11 through an insulating base material 10 and the adhesive layer 12, and a both-surface wiring circuit board 3 which has a second wiring circuit 31, electrically connected to the conductive paste via 15, on both surfaces of a hard insulating base material 30, which has an opening bored including the IC chip 20 electrically connected to the conductive paste via 15. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

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